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ULTRA-HIGH DENSITY BACKPLANE INTERCONNECT SOLUTION

Ultra-High density 56+ Gbp/s PAM4 interconnect platform utilizing proven press-fit technology and a single wafer design optimized for traditional backplane, direct orthogonal, and cable design solutions.

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We make every effort to serve every customer.

We treat all our suppliers on an equal, long-term and mutually beneficial basis.

The company has established good cooperative relations with manufacturers and agents of famous brands in Europe, America, Japan and Korea, and has solid supply channels, 100% quality assurance, competitive prices, fast delivery and perfect and considerate after-sales service. The company in line with the unique marketing strategy, pragmatic and enterprising entrepreneurial spirit, specializing in large and medium-sized enterprises to do perfect supporting services, while attaching importance to the relationship with peer partners, cherish any cooperation and sharing opportunities, and has achieved remarkable results.

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