wafer: It is the most basic processing unit of semiconductor manufacturing industry, and the circuit diagram is burned on the wafer through a certain processing process and cut into IC chips;
Cassette: Cassette is a box used to hold wafers, which is composed of separate slots. Generally, a wafer box can be inserted into 25 wafers; Wafers are processed on a unit basis.
chip: a portion of a chip containing at least one circuit that is divided from a chip containing an array of devices or circuits;
substrate: Material on and within which a device or circuit element is made;
substrate: Sheet material forming a support substrate for membrane circuit components and/or external components;
film: A solid layer formed on a solid substrate by any deposition process;
thinfilm: film deposited on the substrate by growth processes such as vacuum evaporation, sputtering and chemical vapor deposition;
thick file: A film usually deposited on the substrate by the screen printing process;
plated film: A film obtained by chemical and/or electrochemical deposition
